The state-of-the-art fundamentals and applications of micro-energy systems on-chip

Special Topic: Flexible Electronics and Micro/Nanomanufacturing

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Table 6

The materials, preparation method, thickness, area-specific capacitance, energy density, and power density of SC reported in the literatures

Materials	Preparation method	Thickness	Area-specific capacitance	Energy density	Power density	Year	Ref.
Nanoporous gold/MnO	Magnetron sputtering and electro-deposition	100 nm	14 F cm⁻²	55 μWh cm⁻³	3.4 W cm⁻³	2015	[268]
Porous silicon/titanium nitride	ALD	6 μm	15 F cm⁻²	1.3 mWh cm⁻³	214 W cm⁻³	2016	[266]
CNT/graphene	Laser direct writing and plasma processing	156 μm	31.9 mF cm⁻²	0.51 mWh cm⁻³	62.8 W cm⁻³	2016	[267]
SiC	Anodizing and electrochemical etching	40 μm	20 mF cm⁻²	5.24 μWh cm⁻²	11.2 mW cm⁻²	2019	[244]
TiN/Al₂O₃	ALD	‒	1 μF mm⁻²	1.7 μWh cm⁻²	66 W cm⁻²	2020	[270]

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